Chenmko Enterprise
Co. Ltd., with
the head office in Taipei, Taiwan, was founded
in July 1992 and is a small/medium company
employing over 2,500 people in four
countries. Chenmko is a customer-oriented
manufacturer of packaging surface sticking
detachment components. We are ISO9001,
ISO14001 and ISO-TS16949 certified to establish
high quality control technology to improve
product quality in reliability. From 2007,
we formally promoted and started halogens free
manufacture to meet RoHS requirements. Our product line includes switch
diodes, Schottky diodes, standard/quick/super
fast/ultra fast recovery rectifiers, glass
covered rectifiers, bridge rectifiers, Zener
diodes, TVS, small signal transistors, small
signal field effect transistors, resistance
transistors and field effect transistors,
etc.
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With growth of revenues and
market demand, Chenmko keeps improving product
quality and dedicating to developing new products
to meet customers¡¦needs. In 2003, Chenmko
signed a contract with ISI Semiconductors Inc. to
co-use a design R&D center in the U.S. in
order to have more human resources to develop new
products to catch up with progressing market
demands.
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Location
Workforce
Floor
Area
Taipei, Taiwan (Sales
Office and Warehouse)
32
650 sq.
m.
Jiangsu, China (Sales
Office, Factory, R & D, Wafer
Fab,Warehouse)
2,500
120,000 sq.
m.
Hong Kong (Office and
Warehouse)
20
330 sq.
m.
Shanghai, China (Sales
Office and Warehouse)
10
200 sq.
m.
( Intellect Semiconductor
Inc. )
50
500 sq.
m.
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"Research,
development and manufacture of world class
top-notch and highly efficient power
components"
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A team of good cooperation is
the key to success. Customers first and
customer orientation have led us to make customers
satisfied and enable us to continue improving
quality to develop the world class power
components.
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1992
Founded
on 1 July 1992.
1993
Start
of mass production of standard/fast recovery
rectifier and R&D of GPP
products.
1994
Start
of mass production of GPP products, R&D of
fast/super fast/ultra fast recovery rectifiers,
introduction of MIS system.
1995
ISO9001
and ISO14001 certified.
1996
Start
of mass production of super fast/ultra fast
recovery rectifiers. Planning
plant expansion and start of production of
SMA/SMB/SMC package and automotive
rectifiers.
1997
Introduction
of GPP wafers made under EPI process and start
of development of EPI GPP products.
1998
Complete
introduction of SMD automatic test machines and
start of mass production SMD
products.
1999
Adding
SOT-23 and SOD-323 product lines, start of
development of Low Vf and Low Ir
products.
2000
Start
of mass production of SOT-23 and SOD-323 packing
products, which are widely used in mobile
phones, digital cameras and PDAs, etc, start of
development of new generation RF Schottky
rectifiers.
2001
Successful
initial production of SC-70 and SC-59 to be
widely used in mobile phones and desktop PCs,
etc Adding production line of SOD-523,
SOD-123, SC-74, SC-74A, SC-88 and
SC-88A.
2002
Start
of mass production of SOD-523, SOD-123, SC-74,
SC-74A, SC-88 and SC-88A Start of
development of small packaging transistors and
field effect transistors, successful initial
production in August to be widely used in laptop
computers and digital cameras,
etc
2003
R&D
in resistance transistors and IGBT, adding
production lines of SOD-723, SOT-723, SOT-563,
SOT-553 and SOT-543. Formal promotion and practice of unleaded
production process to meet ROHS
standards. Signing
co-R&D agreement with ISI Semiconductors
Inc.
2004
Mass
production of SOD-723 and resistance
transistors, expectation of mass production of
SOT-723, SOT-563, and SOT-553, aggressive
development of MOS chips, Low Vf high electric
current Schottky diodes and adding production
line of SMP.
2005
R&D
in large electricity current Schottky diodes
packaged in SC-76, SC-79, SOD-123,
SOD-123S and SMP; R&D in ESD diodes
and TVS Array, adding FBP production lines;
promoting ISO TS 16949 to meet international
quality standards.
2006
Mass
production of ESD diodes, TVS Array, and
FBP
package,
promoting QC080000 to meet international
environmental
protection quality standards.
2007
Development
of D-PAK large electricity current Schottky
rectifiers & transistors, mass production of
FBPT-723/FBPD-923 Schottky, switching,
transistors and MOS-FET, etc. Introduction
of regulations of China on electronic
information products to be met. Seeking halogen free materials to produce
halogen free products in order to meet standards
of BFRs in HSF. Halogen
free products were completely introduced from 1
September 2007 and shipments have been
made.
2008
Development
of SOT-523/SOT-723/SOT-563 MOS-FET, aggressive
development of LDO, RF transistors and PIN
Diodes,
etc